? semiconductor components industries, llc, 2014 december, 2014 ? rev. 13 publication order number: bat54lt1/d bat54l schottky barrier diodes these schottky barrier diodes are designed for high speed switching applications, circuit protection, and voltage clamping. extremely low forward voltage reduces conduction loss. miniature surface mount package is excellent for hand held and portable applications where space is limited. ? extremely fast switching speed ? low forward voltage ? 0.35 volts (typ) @ i f = 10 madc ? nsv prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant* maximum ratings (t j = 125 c unless otherwise noted) rating symbol value unit reverse voltage v r 30 volts forward power dissipation @ t a = 25 c derate above 25 c p f 200 2.0 mw mw/ c forward current (dc) i f 200 max ma non?repetitive peak forward current t p < 10 msec i fsm 600 ma repetitive peak forward current pulse wave = 1 sec, duty cycle = 66% i frm 300 ma junction temperature t j ?55 to +125 c storage temperature range t stg ?55 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 30 volts silicon hot?carrier detector and switching diodes marking diagram 3 cathode 1 anode sot?23 (to?236) case 318 style 8 (note: microdot may be in either location) device package shipping ? ordering information ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d. bat54l t1g sot?23 (pb?free) 3,000 / tape & reel www. onsemi.com *date code orientation and/or overbar may vary depending upon manufacturing location. jv3 = device code m = date code = pb?free package 1 jv3 m nsvbat54l t1g sot?23 (pb?free) 3,000 / tape & reel
bat54l www. onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit reverse breakdown voltage (i r = 10 a) v (br)r 30 ? ? volts total capacitance (v r = 1.0 v, f = 1.0 mhz) c t ? 7.6 10 pf reverse leakage (v r = 25 v) i r ? 0.5 2.0 adc forward voltage (i f = 0.1 ma) (i f = 1.0 ma) (i f = 10 ma) (i f = 30 ma) (i f = 100 ma) v f ? ? ? ? ? 0.22 0.29 0.35 0.41 0.52 0.24 0.32 0.40 0.50 0.80 v reverse recovery time (i f = i r = 10 madc, i r(rec) = 1.0 madc, figure 1) t rr ? ? 5.0 ns notes: 1. a 2.0 k variable resistor adjusted for a forward current (i f ) of 10 ma. notes: 2. input pulse is adjusted so i r(peak) is equal to 10 ma. notes: 3. t p ? t rr +10 v 2 k 820 0.1 f dut v r 100 h 0.1 f 50 output pulse generator 50 input sampling oscilloscope t r t p t 10% 90% i f i r t rr t i r(rec) = 1 ma output pulse (i f = i r = 10 ma; measure d at i r(rec) = 1 ma) i f input signal figure 1. recovery time equivalent test circuit
bat54l www. onsemi.com 3 c t , toatal capacitance (pf) 100 0.0 0.1 v f , forward voltage (volts) 0.2 0.3 0.4 0.5 10 1.0 0.1 85 c 10 v r , reverse voltage (volts) 1 0.1 0.01 510 15 20 25 14 0 v r , reverse voltage (volts) 12 4 2 0 51015 30 figure 2. forward voltage figure 3. leakage current figure 4. total capacitance ?40 c 25 c t a = 150 c t a = 125 c t a = 85 c t a = 25 c 0.6 ?55 c 150 c 125 c 100 1000 30 25 20 6 8 10 i r , reverse current ( a) i f , forward current (ma) 0
bat54l www. onsemi.com 4 package dimensions sot?23 (to?236) case 318?08 issue ap style 8: pin 1. anode 2. no connection 3. cathode mm inches scale 10:1 0.8 0.031 0.9 0.035 0.95 0.037 0.95 0.037 2.0 0.079 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* d a1 3 12 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. dimensions d and e do not include mold flash, protrusions, or gate burrs. view c l 0.25 l1 e e e b a see view c dim a min nom max min millimeters 0.89 1.00 1.11 0.035 inches a1 0.01 0.06 0.10 0.001 b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003 d 2.80 2.90 3.04 0.110 e 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 l 0.10 0.20 0.30 0.004 0.040 0.044 0.002 0.004 0.018 0.020 0.005 0.007 0.114 0.120 0.051 0.055 0.075 0.081 0.008 0.012 nom max l1 h 2.10 2.40 2.64 0.083 0.094 0.104 h e 0.35 0.54 0.69 0.014 0.021 0.029 c 0 ??? 10 0 ??? 10 on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 bat54lt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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